A total solution for X-ray inspection that supports all aspects of semiconductor manufacturing.
From the lab to the fab, from wafers to chips, guiding inspection strategies to the next stage.
Innovating inspection strategies in the semiconductor industry with 2.5D/3D X-ray inspection. Non-destructive and high-resolution imaging technology visualizes critical points related to yield, reliability, and performance faster than ever before. This technology demonstrates its full potential, especially in advanced packaging and miniaturized devices. Comet's Solutions ▸ Front-end process development ▸ Wafer production ▸ Back-end process development ▸ Chip production
